AE04  MATERIALS & PROCESSES

 

1.      Crystal structures and Bondings                                                                                                             7 hours

 

1.1   Structure of the atom, ionization potential, electron affinity.

1.2   Bondings: Chemical, ionic and covalent bond energy and energy of cohesion.

1.3   Crystal geometry, Miller indices, inter planer  separation, Bragg’s Law.

1.4   Simple crystal structures (SC, BCC, FCC, & HCP): Covalent crystals (Ge, Si), ionic crystal (NaCl) and metallic crystals (Cu, Ag, Al, Fe, Mg & Zn).

 

I [3, 4, 5];  II [35]

 

2.      Crystal imperfections                                                                                                                               4 hours

 

2.1   Point, line, surface & volume imperfection, Frenkel and Schottky defects.

2.2   Geometry of edge  and screw dislocations, Burgers vector.

 

I [6];  II [37]

 

3.      Phase Diagrams                                                                                                                                        4 hours

 

3.1   The phase rule (Gibb’s phase rule).

3.2   Single component system.

3.3   Binary phase diagram, Eutectic system.

3.4   The lever rule, Tie-line rule.

3.5   Zone refining.

 

I [7]; II [39]

 

4.      Diffusion in solids                                                                                                                                     4 hours

 

4.1   Fick’s Laws and its solutions, Doping applications.

4.2   Atomic model of diffusion.

4.3   The Einstein relation.

 

I [8];  II [47]

 

5.      Conducting materials                                                                                                                               7 hours

 

5.1   Free electron theory, Fermi function, energy states.

5.2   Metallic conduction: Conductivity, mobility and relaxation time.

5.3   Properties and uses of common conducting materials (e.g. maganine, nichrome, graphite, silicon carbide), filaments and contact materials.

 

I [14]

 

6.      Semi-conducting materials and devices                                                                                                  7 hours

 

6.1   Energy bands in solids, energy gap.

6.2   Intrinsic and extrinsic (p-type and n-type) semiconductor.

6.3   Carrier concentration and conductivity.

6.4   Properties of common semi conducting materials.

6.5   Hall effect and its application.

6.6   p-n junction, junction diodes and junction transistors (pnp, npn) and their characteristics.

 

I [15]

 

7.      Dielectric Materials                                                                                                                                 7 hours

 

7.1   Polarization and polarizability, local electric field.

7.2   Ionic, orientational and electronic polarization.

7.3   Temperature and frequency dependence, dielectric losses, dielectric strength.

7.4   Ferroelectricity & piezoelectricity and their application.

7.5   Properties and applications of common dielectric materials (e.g. glass, porcelain, PVC, bakelite, rubber, mica and transformer oil).

 

I [17]; II [25]

 

8.      Magnetic Materials                                                                                                                                  7 hours

 

8.1   Ferromagnetism, domain structure, hysterises  loop, eddy current losses.

8.2   Soft magnetic materials; Fe-Si alloys for power transformers, Ni-Fe alloys (permalloy) for pulse transformers, chokes and communication equipments.

8.3   Ferrimagnetism; Ferrites for high frequency transformers and computer memory cores.

8.4   Hard magnetic material; Carbon Steels, Alnico alloys and barium ferrite.

 

I [16]; II [12]

 

9.      Processing of Electronic Materials                                                                                                          5 hours

 

9.1   Fabrication of integrated circuits.

9.2   Semiconductor grade silicon, single crystal growth.

9.3   Wafer manufacture, oxidation.

9.4   Photolithography, Doping.

9.5   Ion implantation, epitaxial growth (CVD) and Metallisation.

 

I [15]

 

10.   Common fabrication processes                                                                                                               4 hours

 

10.1      Introduction to welding, soldering and brazing.

10.2      Casting, Forging & Rolling.

10.3      Extrusion and wire drawing.

 

II [50, 57]

 

11.   Simple heat treatment processes                                                                                                            4 hours

 

[Definition, purpose, concept (Procedure in brief)]

11.1      Principles (Fundamentals) of heat treatment.

11.2      Annealing & Normalizing.

11.3      Hardening (by Quenching) and Tempering.

 

II [43]

 

Text Books

 

I.       V. Raghavan, “Materials Science and Engineering” A first course, Prentice Hall of India, New Delhi, 4th  Edition (2000)

II.    O. P. Khanna, “ A text book of Material Science and Metallurgy” Dhanpat Rai Publications, New Delhi, (1998)

 

Reference Books

 

  1. C. S. Indulkar and S. Thiruvengadam, “ An Introduction to Electrical Engineering Materials”, S. Chand and Co., New Delhi (2003).
  2. Mubeen and Mubeen, “Material Science”, Khanna Publishers, Delhi, Second Edition.
  3. Lawrence H. Van Vlack, “ Elements of Materials Science and Engineering”, Pearson Education, 6th Edition.